Feature:
Automatic BGA Rework Station is an advanced SMT rework system designed for fully automated removal, reballing, and replacement of Ball Grid Array (BGA), CSP, QFN, and other complex package components. Featuring precision infrared heating, hot air circulation, and intelligent vision alignment, this station streamlines the rework process with minimal operator intervention.
Ideal for high-volume electronics manufacturing, this machine ensures consistent, high-quality solder joints while reducing downtime and labor costs. It supports lead-free soldering and is suitable for repairing multilayer PCBs in automotive, aerospace, telecom, and consumer electronics industries.
Precision Rework Solution for Ball Grid Array Components
Key Applications of BGA rework station
• Automated removal and placement of BGAs, CSPs, and QFNs
• High-precision rework for defective or misaligned SMT components
• Integration into SMT production lines for real-time repair
• Suitable for complex, high-value PCBs requiring reliable rework
Usage Benefits BGA rework station
• Reduces manual labor and operator errors with automated workflows
• Provides consistent thermal profiles for reliable solder joints
• Improves throughput and minimizes production downtime
• Advanced vision system ensures perfect component alignment every time
Specification:
1
Total Power
22KW(Max)
2
Top heater
2000W(1st heater)
3
Bottom heater
2000W(2nd heater)
4
3rd IR heater
16000W(the left six IR heating plate can be controlled independently)
5
power
AC 380V±10% 50/60Hz
6
Electrical materials
Servo Drive (Panasonic)＋Industrial Host+ Heating plate(Germany)
7
Optical system
Servo Drive+ Automatic Vision Alignment System （Panasonic）
8
Temperature control
K-type thermocouple (Closed Loop), intelligent temperature compensation system, temperature precision within ±1 degree
9
Positioning
V-groove PCB support， and with external universal fixture
10
PCB size
660*600mm(Max);10*10mm(Min)
11
BGA chip
120*120mm(Max);1*1mm(Min)
12
External temp sensor
8 pcs
13
Work Mode
Computer intelligence operations
14
Placement Accuracy
X, Y axis and the R angle with micrometer adjust, servo drive, accuracy within ± 0.01MM
15
Dimensions
L1235*W1215*H1850mm (LCD stand not included)
16
Net weight
660kg
