●12-section temperature control, which is in accordance with the lead-free repair process.
●The temperature curve can be analyzed and reported automatically. The origin can be traced if it has an exceptional quality problem.
●Mass temperature parameters can be stored. It is very convenient to obtain the history parameters.
●It has a high-definition optical alignment system which can move forward and back;up and down automatically.You can inspect the edge of BGA all directions and mount the component accurately.
Feature:
BGA REWORK STATION 785
The Semi-Automatic BGA Rework Station is a versatile and cost-effective SMT rework solution designed for the precise repair of Ball Grid Array (BGA), CSP, QFN, and other fine-pitch components. It combines automated features like precise temperature profiling, vision alignment, and programmable reflow control with manual component handling, offering flexibility and high accuracy in PCB rework tasks.
Smart Rework Control for Precision BGA Repair
Ideal for mid-volume production, R&D labs, and repair centers, this station supports both lead-free and leaded soldering processes, making it a popular choice for industries like telecom, automotive, medical, and consumer electronics.
Key Applications
• Accurate removal and reinstallation of BGAs and other SMT components
• Suitable for multilayer PCB repair, reballing, and prototype development
• Commonly used in electronics repair facilities, R&D environments, and low-to-mid volume SMT production lines
Usage Benefits of Semi Automatic BGA rework station
• Combines automation with manual flexibility for better control
• Real-time vision system ensures accurate alignment and placement
• Cost-efficient alternative to fully automatic rework systems
• Enhances rework quality while reducing human error
Specification:
|
Power Supply: |
AC 380V±10% 50/60 Hz |
|
Total Power: |
9.85KW(Max) |
|
Power of Top Hot Air Heater: |
1450 W |
|
Power of Bottom Hot Air Heater: |
1200 W |
|
Power of IR pre-heater: |
6600 W |
|
Other |
600 W |
|
Temperature Error: |
±1℃ |
|
Placement Accuracy: |
±0.01mm |
|
Placement Pressure: |
＜0.2N |
|
Hot Air Heating Temperature: |
400℃（Max） |
|
PCB Size: |
635*520mm (Max);6*6mm (Min) |
|
BGA Chip Size: |
80*80mm (Max);2*2mm (Min) |
|
Control system: |
Industrial PC+ Motion control system |
|
Dimension: |
L835*W960*H1640mm |
|
Sensor: |
5 pcs |
|
Net Weight: |
About 218.5kg |
|
Color: |
White/Red |
