AOI&SPI Inspection
PARMI Xceed 3D AOI Machine – High-Speed Automatic Optical Inspection System
PARMI Xceed is a cutting-edge 3D automatic optical inspection (AOI) equipment designed for electronic manufacturing quality control. It integrates 2D/3D hybrid inspection technology with a high-speed TRSC-1 sensor head, achieving an inspection speed of 65cm²/sec and supporting PCBs up to 40mm in component height. With user-friendly Veriworks software, real-time defect analysis, and seamless network connectivity, it efficiently detects missing components, misalignment, solder defects, and foreign materials, while ensuring high accuracy even for warped PCBs (±5mm).
PRODUCT DETAIL
Feature:
Component detection software
· Simple and fast component programming
·The software interface is composed of multi-functional Windows, making it more convenient to use
Replay software
·Conduct a secondary re-evaluation of the detected defects
·Real-time analysis of poor 2D &3D images
·Support remote re-evaluation by multiple online devices
· Search for bad resumes by scanning the barcode
Process Statistical Analysis Software
· Practical and excellent on-site integrated analysis functions
·Data can be remotely read via the network
It can detect components up to 40mm in size and remove shadows
PCB surface inspection
Real-time detection of PCB bending
Image:
Specification:
| Model | Xceed | Xceed L | Xceed XL | Xceed XXL | Xceed Dual | Xceed Dual L | Xceed Duo | Xceed DSI |
| Vision Module:TRSC-I | ||||||||
| Measuring Principle | Shadow Free Dual Laser Optical Triangulation | |||||||
| Camera | 4M Image Sensor/Telecentric Lens | |||||||
| Illumination | R.G.B LED 3 Stage Lightings | |||||||
| Scan Speed (sq.cm/sec) | 65 | |||||||
| X-Y Resolution(μm) | 14×14 | |||||||
| Scan Path Width (mm) | 32 | |||||||
| Height Resolution(μm) | 0.4 | |||||||
| Performance | ||||||||
| Height Repeatability | [Less than 3mm:3μm a 3o Limit]/[Higher than 3mm:6μm a3o Limit],on a certification target | |||||||
| Height Accuracy | [Less than 3mm:3μm @3o Limit]/[Higher than 3mm:25μm Q 3o Limit],on a certification target | |||||||
| Measurement | ||||||||
| Inspection Type |
Dimension,Missing,Wrong(Body),Reverse,Misalignment (X/Y Rotation),Side Mount,Tombstone,Upside Down,Lift,
TextOCV/OCRJ,Wrong[Matching],Solder Joint,Lead Missing,Lead Misalignment,Lead Lift,Bridge,Color Band,Pin,Pressfit,Coplanarity,etc.
|
|||||||
| PCB Warpage (mm) | ±5〔2%〕 | |||||||
| Max.Component Height (mm) | 40(Option 60) | |||||||
| Panel Dimension | ||||||||
| Min.Size(mml | 50×50 | |||||||
| Max.Size(mm) |
410×350
[3 Stage Conveyor Option
:410×350)
|
510×510 | 900×610 | 1,200×450 |
410×320
[3 Stage Conveyor Option
:410×320]
|
510×320 | 350×250 | 420×350 |
| Thickness(mm) | 0.4～5 | 0.4～5 | 0.4～10 | 0.4～10 | 0.4～5 | 0.4～5 | 0.4～5 | 0.4～3 |
| Max.Weight (kg) | 2 | 4 | 6 | 6 | 2 | 2 | 2 | 3 |
| Top/Bottom Edge Clearance(mm) | 2.5/3.3 | 2.5/3.3 | 2.5/4 | 2.5/4 | 2.5/3.3 | 2.5/3.3 | 2.5/3.3 | 3/3 |
| Top/Bottom Clearance (mm) | 40/50 | 40/50 | 40/50 | 40/50 | 40/30 | 40/30 | 40/20 | 40/40 |
| System Dimension | ||||||||
| W×D×H(mml |
850×1,205×1,525
[3Stage Conveyor Option
:1,310×1,205×1,525]
|
950×1,365×1,525 | 1,400×1,540×1,525 | 1,720×1,350×1,525 |
850×1,580×1,510
(3 Stage Conveyor Option
:1,450×1,645×1,510)
|
950×1,580×1,510 |
1,210×1,212×1,510(1setl
1,210×2,434×1,510 {2setl
|
1,610×1,365×1,525 |
| Weight (kg) | 730 | 820 | 930 | 1,140 | 760 | 850 | 800(1set) | 800 |
| Conveyor Height (mm) | 860～970 | |||||||
| Conveyor Speed Range (mm/sec) | 300～1,000 | |||||||
| Panel Flow Direction | Left to Right,Right to Left (Factory Settingl | |||||||
| Conveyor Width Adjusting | Auto | |||||||
