PCB size: 50*50 mm ~ 450*380 mm (larger sizes can be customized according to customer requirements)
PCB thickness: 0.3~6mm
PCB board weight: ≤3KG
machine dimension: 1050mm*1120mm*1830mm (L*W*H) Height does not include alarm light
Weight: 600KG
Feature:
High-end double-sided online automatic optical inspection machine CR-D900
Precision optical imaging
Double-sided structure: cameras on both sides move at the same time, capture images at the same time, and detect both sides at the same time, achieving ultimate speed while ensuring the imaging effect.
Telecentric lens: shoots images without parallax, effectively avoids reflection interference, minimizes tall components, and solves the problem of depth of field
Industrial cameras take high-speed images and capture high-definition images
Three-color tower light source RGB three-color LED and multi-angle tower-shaped combination design can accurately reflect the slope level information of the object surface
Collinearity: The backplane LED light strip needs to detect the relative offset of two LEDs to ensure that the entire LED light strip is collinear, which perfectly solves the industry problem of S-type non-collinear LED distribution testing, which is achieving non-adjacent LED collinearity analysis and judgment.
Resistor value identification: This algorithm uses the latest machine identification technology to calculate the precise resistance value and electrical characteristics of the resistor by identifying the characters printed on the resistor. This algorithm can be used to detect wrong parts of the resistor, and at the same time realize automatic matching of "substitute materials" function.
Scratch detection: This algorithm will search for dark stripes of specified length in the target area and calculate the average brightness value of the dark stripe area. This algorithm can be used to detect scratches, cracks, etc. on flat surfaces.
Intelligent judgment: This algorithm collects various qualified and bad image samples respectively, establishes an intelligent judgment mode through training, and calculates the similarity of the images to be tested. This algorithm simulates the human thinking mode and can solve some problems that are difficult to detect with traditional algorithms. Take it easy. For example: wave solder joint detection, reset solder ball detection, polarity detection of circular components, etc.
Image:

Specification:
Optical system
optical camera
5 million high-speed intelligent digital industrial cameras (optional 10 million)
Resolution (FOV)
Standard 10μm/Pixel (corresponding to FOV: 24mm*32mm) 10/15/20μm/Pixel (optional)
optical lens
5M pixel level telecentric lens
Light source system
Highly bright RGB coaxial annular multi-angle LED light source
Hardware Configuration
operating system
Windows 10 Pro
Computer Configuration
i7 CPU, 8G GPU graphics card, 16G memory, 120G solid state drive, 1TB mechanical hard drive
Machine power supply
AC 220 volts ±10%, frequency 50/60Hz, rated power 1.2KW
PCB direction
Can be set to left → right or right → left by pressing the button
PCB plywood method
Automatic opening or closing of double-sided clamps
Z-axis fixation method
1 track is fixed, 2 tracks are automatically adjustable
Z-axis track adjustment method
Automatically adjust width
conveyor height
900±25mm
air pressure
0.4~0.8Map
machine dimension
1050mm*1120mm*1830mm (L*W*H) Height does not include alarm light
machine weight
600kg
Optional configuration
Offline programming software, external barcode gun, MES traceability system interface open, maintenance station host
Up and down detection method
Optional: enable upper detection alone, lower detection alone or upper and lower detection simultaneously.
PCB specifications
PCB size
50*50 mm ~ 450*380 mm (larger sizes can be customized according to customer requirements)
PCB thickness
0.3~6mm
PCB board weight
≤3KG
Net weight
Upper clear height ≤ 40mm, lower clear height ≤ 40mm (special requirements can be customized)
Minimum test element
01005 components, 0.3 mm pitch and above IC
Test items
Solder paste printing
Presence or absence, deflection, less tin, more tin, open circuit, pollution, connected tin, etc.
Part defects
Missing parts, offset, skewed, tombstones, sideways, overturned parts, reverse polarity, wrong parts, damaged, multiple parts, etc.
Solder joint defects
Less tin, more tin, continuous tin, virtual soldering, multiple pieces, etc.
Wave soldering inspection
Inserting pins, Wuxi, less tin, more tin, virtual soldering, tin beads, tin holes, open circuits, multiple pieces, etc.
Red plastic board detection
Missing parts, offset, skewed, tombstones, sideways, overturned parts, reverse polarity, wrong parts, damage, glue overflow, multiple parts, etc.





