Feature:

1.Full-Automatic Operation: Flying probe technology enables automatic component measurement (resistance, capacitance, inductance) and angle adjustment—no manual clamping or range switching required.

2.Ultra-High Efficiency: Replaces 2 manual workers with 0 personnel needed during detection, saving up to 52,000 yuan/month for 8 SMT lines and supporting PCB sizes up to 800×600mm.

3.Comprehensive Defect Detection: Combines optical character recognition (for screen printing, polarity) and laser-based blank position inspection to identify BOM mismatches, missing/wrong parts, and extra components.

4.Seamless Integration & Traceability: Connects to MES systems, auto-generates unalterable reports, and features power-off protection to resume inspections from the interrupted point.

5.User-Friendly & Flexible: Supports multi-format BOM import, automatic bitmap generation for component positioning, and pneumatic board fixing for stable testing of different thicknesses.

Image:

Specification:

Model:CR-FAI998
Item	Detailed parameters
Circuit board detection	SMT furnace front circuit board (pertinax and red board); The solder paste boards only visual test and it does not support the electrical test.
The component size can be detected	For the component at the British 01005 and above, only one set of the probe is required to test.
Detection method	The probe can be selected to realize the automatic measurement of resistance, capacitance and inductance, to determine the test results automatically. The IC and triode can be inspected using the automatic optical characters, to quickly check the screen printing and polarity. The diodes can distinguish polarity and light up LEDs The average detection speed is 1 second/component and it is 3-5 times of the traditional FAI.
LCR bridge	Test frequency: 20Hz～ 300KHz, basic precision: 0.05%. Measurement and display range: R: 0.01m ohms - 99.9999M oh msL: 0.01nH～9999.9H C: 0.00001pF～9.9999F. The testing software can directly control and select the measuring gears and parameters.
Detection category covered	Data: wrong consumption of BOM, repetitive position, missing definition or more definitions of XY coordinates. Circuit board: more pastes, missing parts, wrong parts, reverse, flip over, offset or rotation, etc.
SPC process control	The test data are recorded in the whole process and it can output the statement in PDF to restore the test scenario in the later period and provide the tracing basis.
Component angle	Support the parts at any angle from 0 to 360 °
Server mode	The central data base is selected to realize the centralized and unified management of FAI data.
MES system connection	Free open communication interface
Inspection results display	21.5-inch liquid crystal display
Range of PCB size	M: 400mm*450mm, L: 650mm*550mm, XL: 800mm*600mm (it supports the customization of large sizes).
PCB clear height	Upper side: 25mm Bottom side: 50mm